| PART |
Description |
Maker |
| B30 B3022BC1 B3022BG1 B3022BD1 B3022BB1 B3022BA1 |
FEMALE HEADER PROFILE : 5.8mm SIDE-ENTRY TYPE (DUAL ROW)
|
DB Lectro Inc.
|
| B27A140BTA1 B27A B27A140BTB1 B27A12BAA1 B27A12BAB1 |
FEMALE HEADER SINGLE ROW PROFILE : 5.0mm SMT TYPE
|
DBLECTRO[DB Lectro Inc]
|
| B29 B29140BG1 |
FEMALE HEADER PROFILE : 3.3mm SIDE-ENTRY TYPE(SINGLE ROW) 母简介：三点三毫米侧入型（单列）
|
DB Lectro Inc.
DB Lectro, Inc.
|
| 71764-0030 0717640030 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right An
|
Molex Electronics Ltd.
|
| B2522BSA1 B25240BTB1 B25 B2522BAA1 B2522BAB1 B2522 |
FEMALE HEADER PROFILE : 5.0mm DUAL-ENTRY TYPE
|
DBLECTRO[DB Lectro Inc]
|
| 71764-0106 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 71764-0108 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0702461404 70246-1404 |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin (Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin (Sn) PC TailPlating
|
Molex Electronics Ltd.
|
| 70247-3054 0702473054 |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
|
Molex Electronics Ltd.
|
| 0010894262 10-89-4262 A-70216-0246 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, High Profile, Dual Row, Right Angle,26 Circuits, 6.10mm (.240") Mating Pin Length, 0.38渭m (15渭") Gold (Au) Select
2.54mm (.100) Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle,26 Circuits, 6.10mm (.240) Mating Pin Length, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0010894222 10-89-4222 70216-0244 A-70216-0244 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, High Profile, Dual Row, Right Angle,22 Circuits, 6.10mm (.240") Mating Pin Length, 0.38渭m (15渭") Gold (Au) Select
2.54mm (.100) Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle,22 Circuits, 6.10mm (.240) Mating Pin Length, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 70216-0242 |
2.54mm Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle, 18
|
Molex Electronics Ltd.
|
|
